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IEC 62047-13 2012 Semiconductor devices - Micro-electromechanical devices - Part 13 Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
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IEC 62047-13 2012 Semiconductor devices - Micro-electromechanical devices - Part 13 Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
